Custom Gas Purifier Systems

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Process Gas Purification
Custom Gas Purifier Systems

Pall purifier systems enable the removal of molecular contamination to sub-parts-per-billion (ppb) levels from a variety of gases used in the semiconductor, photovoltaic, LED and display industries. They are well suited for applications such as bulk delivery and gas bottle filling.

Flow rates up to 4,000 slpm (141 scfm)
Purifier assemblies contain integral particle filters
Isolation valves allow for easy replacement of individual assemblies
Custom configurations available to meet specific customer requirements

Products on this page may be covered by one or more patents, including US 7,465,692

Specifications

Purifiable Gases and Removal Efficiency	See Table 1
Materials	All wetted surfaces are electropolished 316L stainless steel (except for the purification material) ≤ 0.25 μm / 10 μin Ra internal surface finish Housings meet or exceed VIM / VAR specifications
Particle Removal Rating¹	≥ 0.4 μm (3 nm particle filter assemblies Removal available as stand-alone units)
Housing Pressure Ratings	Standard pressure: 1.7 MPa (250 psig) High pressure: 20.7 MPa (3,000 psig)
Configurations	Manifold contains 1 to 4 assemblies to accommodate flow rates up to 4,000 slpm (141 scfm) Available with customer specific connections and components
Certifications	ASME: Vessel is designed and manufactured in accordance with the ASME BPVC Section III, Div 1 and is U-stamped PED: Available for most categories of gases
Leak Rating	Assemblies are 100% helium leak tested to 1 x 10^-9 atm-cm³/s

¹ Particle rating is based on laboratory testing with NaCl aerosol.

Technical Information

Table 1: List of Purifiable Gases

Gas	Purifier Material Code	Effluent Material Specification²
Nitrogen, argon, helium, xenon, krypton, neon	INP	<1 ppb H₂O, O₂, CO₂ and CO
Silane, hydrogen, methane, ethane, cyclopropane, propane, dimethyl ether	SIP	<1 ppb H₂O, O₂, CO₂ and CO
Carbon monoxide	SIP	<1 ppb H₂O, O₂, CO₂, Ni(CO)₄ and Fe(CO)₅
Fluoromethane, diflouromethane, trifluoromethane, tetrafluoroethane, pentafluoroethane, heptafluoropropane, carbon tetrafluoride, perfluoropropane, perfluorocyclobutane, hexafluoroethane	FCP	<1 ppb H₂O, O₂, and CO₂
Germane	GEH4P	<1 ppb H₂O, O₂, and CO₂
Sulfur hexafluoride	SF6P	<1 ppb H₂O, O₂, and CO₂
Air, carbon dioxide, oxygen, nitrous oxide	OXP	<10 ppb H₂O
Boron trichloride, chlorine, trichlorosilane, dichlorosilane	CLXP	<100 ppb H₂O
Hydrogen chloride	HCLP	<15 ppb H₂O
Hydrogen bromide	HBRP	<50 ppb H₂O
Photolithography clean dry air	CDAP	<1 ppb H₂O, <1 ppb organics (as C₄), <10 ppt acid gases (as SO₂), <15 ppt basic gases (as NH₃), <1 ppt refractory compounds (as HMDSO)

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